Automation for Fabrication and Testing of Optoelectronics

10-11 May 2017
Achim, Germany

Hosted by

ficontec1
Programme

The purpose of this workshop is to bring together equipment manufacturers and SMEs to discuss the small- and medium volume production of optoelectronic components and to identify bottlenecks in process automation.

Please note the programme below may still be subject to minor changes.

10 May 2017

12:00-13.30 Registration and Lunch

13:30 Welcome by ficonTEC
Welcome by Jose Pozo, Setting the scene
13:45 Session 1: Setting up the Scene

13:45 KEYNOTE: The evolution of automated PICs assembly and testing: planning for increased production volumes and lowering the cost-per-part, Ignazio Piacentini, Director of Business Development, ficonTEC
14:15 Challenges in Automated Assembly of Photonics Components: The Huawei perspective, Mirvais Yousefi, Principle Engineer, Huawei Technologies
14:30 Current and future trends in microdispensing technology, Kaoru Okuyama, Managing Director, Musashi Engineering Europe
14:45 Laser Diode company needs in backend equipment automation, Daniil Livshits, CEO, Innolume
15:00 New algorithm for FAC automatic assembly in high power laser modules based on Artificial Neural Networks, Giammarco Rossi, Senior R&D Engineer, OPI Photonics
15:15 Networking Break
16:00 Session 2: PIC Automated testing and assembly I

16:00 Parallelism in Nano-Alignment and its Consequences for Silicon Photonics Manufacturing & Test, Scott Jordan, Physik Instrumente (PI)
16:15 Towards wafer scale testing of photonic integrated circuits, Milan Milosevic, Research Fellow, University of Southampton
16:30 A new approach to single-mode fiber-chip coupling, Stephan Suckow, AMO
16:45 Challenges for scaling PIC based module production for a broad scale of applications, Joost van Kerkhof, COO, Lionix International
17:00 End of first day

17:15 Departure to hotel Boothaus
18:30 Reception and dinner at Boothaus

11 May 2017

8:45 Depart to ficonTEC – Meeting point: Boothaus lobby
9:00 Arrival and welcome coffee
9:30 Recap of first day by Jose Pozo
Session 3: PIC Automated testing and assembly II
9.45 Needs of automation for Photonic Packaging: from the process point of view, Marcello Tienforti, Senior Photonic Packaging Engineer, Cordon group

10:00 Challenges for integrated optics implementation in access networks, Jan Watte, R&D manager, Commscope

10:15 Interconnect for high performance semiconductor components: Application to photonics”, Bradford Factor, Bradford Factor, ASE Europe

10:30 High volume assembly of laser diodes for CMOS photonics, Gunther Vollrath, CEO, Aifotec
10:45 Networking break
Session 4: Optoelectronics micro-assembly and tools

11:30 Additive Manufacturing of Optics, Nicole Lindenmann, Nanoscribe

11:45 Automated alignment of hybrid diode laser and micro optical glass assemblies, Gunnar Böttger, Senior Scientist , Fraunhofer IZM

12:00 Visual testing and quality control with neuronal networks and 3D lightfield imaging, Philipp Schmid, Head Robotics & Automation, CSEM

12:15 Flexible feeding of sensitive parts in the electronics and photonics domains, Alain Codourey, asyril

12:30 Lunch
13:30 Panel discussion and action points definition
14:00 Company tour ficonTEC

Venue

ficonTEC
Rehland 8
28832 Achim
Germany

Suggested hotel:
Hotel Bootshaus
Uesener Weserstraße 17
28832 Achim
www.hotel-bootshaus.de
To reserve a room, please email the hotel directly: info@hotel-bootshaus.de and use code: EPIC workshop.

Please note that Boothaus currently doesn’t have any rooms on the night of 9 May. Other hotel suggestions are Landhaus Haberkamp in Achim (10 km to ficonTEC), Best Western in Achim-Uphusen (10 km to ficonTEC), Gieschens in Achim (6 km to ficonTEC).

Registration

Please note this is an Invitation only event with a maximum of 30 places available. Should you wish to attend, please contact Carmen Ferrari, Events and Marketing Manager at EPIC.

  • EPIC members: 200 EUR (excluding VAT)
  • Non-members: 300 EUR (excluding VAT)
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