The need to improve, speed-up, and reduce cost of packaging and assembly of optoelectronic devices is in constant debate. But as production numbers increase, another need is also attracting more attention: Testing. In many optoelectronic devices (Silicon Photonics, InP PICs, VCSELs, LEDs, DFB lasers…) testing is performed at wafer level, at die level, as well as in a packaged device or module, and requires the combination of more conventional electrical probing and optical measurements, either with probing fibres or by means of near field / far field beam analysers. The meeting will discuss the requirements and find combined solutions by means of collaboration between top companies and R&D centres in the field. Similar to packaging, testing starts at design level and ends with automated test machines. The discussions will range from probing techniques, handling, test procedures and also touch briefly on the needs and requirements for dedicated modular instrumentation.
THURSDAY 15 FEBRUARY 2018
11:00-12:00 Registration and Light Lunch @YELO
12:00-13:00 Company visit
13:00 – 13:05 Welcoming words, program overview / Jose Pozo, Director of Technology, EPIC & Representative of YELO (TBA.)
13:05 – 13:20 TBA. / Representative of YELO (TBA.)
13:20 – 13:40 TBA. / Scott Jordan, Head of Photonics, Physik Instrumente (PI)
13:40 – 14:00 Silicon Photonic Integration Platform for Optical Communications and its Testing / Hiroshi Fukuda, Senior Research Engineer, NTT
14:00 – 14:20 High Frequency Testing of Novel Low Loss RF and Microwave Interconnects for a New 50GHz GaAs Optical Modulator / Nigel Cameron, Applications Engineer, Axenic
14:20 – 14:40 TBA. / Ignazio Piacentini, Director of Business Development, ficonTEC
14:40 – 15:00 Automated Testing for Generic Integration Platforms / Weiming Yao, Researcher, Photonic Integration Technology Center
15:00 – 15:20 Wafer-level electro-optical testing of silicon photonics components / Jeroen De Coster, R&D R&D Engineer, imec
15:20 – 15:40 Highly reproducible fabrication and testing of silicon photonics devices on 300-mm wafers / Tsuyoshi Horikawa, Senior Researcher, PETRA
15:40 – 16:00 TBA. / Philippe Grosse, Cea
16:00 – 18:00 TBA. sooon
18:00 Transfer from YELO to Titanic
19:00-22:00 Dinner @Titaniс
No transfer after the dinner as hotel is nearby
FRIDAY 16 FEBRUARY 2018
08:00 Transfer from Titanic Hotel to YELO. We kindly remind you to check out of the hotel and take your luggage if you are planning to leave to an airport after the workshop
08:30-09:00 Networking welcome coffee @YELO
Yelo (Trooperslane Industrial Estate, 20 Meadowbank Rd, Carrickfergus BT38 8YF).
The recommended hotel for all participants is Titanic Hotel Belfast (Queen’s Road, Titanic Quarter, Belfast BT3 9DT, Northern Ireland). Prices: 140 GBP per night for a single room & 150 GBP per night for a double room.
Please book your room (-s) over the phone : 028 9508 2000 or email: email@example.com until 1 February 2018 with the code EPIC (mention it during a phone call or in an email).
EPIC members and invited companies: 200 EUR (excluding VAT).
Non-members: 300 EUR (excluding VAT).
Information about self transfers from the airport / to airports to / from Hotel / YELO will be announced here soon.
If you have any questions, please contact EPIC events manager Neringa Norbutaite by firstname.lastname@example.org