The need to improve, speed-up, and reduce cost of packaging and assembly of optoelectronic devices is in constant debate. But as production numbers increase, another need is also attracting more attention: Testing. In many optoelectronic devices (Silicon Photonics, InP PICs, VCSELs, LEDs, DFB lasers…) testing is performed at wafer level, at die level, as well as in a packaged device or module, and requires the combination of more conventional electrical probing and optical measurements, either with probing fibres or by means of near field / far field beam analysers. The meeting will discuss the requirements and find combined solutions by means of collaboration between top companies and R&D centres in the field. Similar to packaging, testing starts at design level and ends with automated test machines. The discussions will range from probing techniques, handling, test procedures and also touch briefly on the needs and requirements for dedicated modular instrumentation.
EPIC members and invited companies: 200 EUR (excluding VAT)
Non-members: 300 EUR (excluding VAT)