Photonics & Opto-Electronics Packaging Conference

22-23 November 2016

Edinburgh, United Kingdom

IMAPS UK
JEMI UK
EPIC logo low resolution
SEMI logo

Jointly organized by:
IMAPS (International Microelectronics, Assembly and Packaging Society)
JEMI UK (Joint Equipment Materials Initiative)
EPIC (European Photonics Industry Consortium)
SEMI (Semiconductor Equipment and Materials International).

 

Download final version of the proceedings here

The following companies have already said they’re coming:
Amkor Technology, Bay Photonics, CSEM, Disco Hi-Tec UK, Eindhoven University of Technology, Entegris, EPIC, Europe Plasma Therm, Exception EMS – Fabrinet, ficonTEC, Fraunhofer HHI, Huawei Technologies, Huawei-CIP, HWU, IBM, INNOVATE UK, INPHOTEC – CNIT Laboratorio Nazionale Reti, Fotoniche, Inseto, INSETO UK, JEMI, Kaiam Europe, KOA Europe, LEW Techniques, Linkra, LioniX International, Lumerical Solutions, Megatech, Micross Components, Microtest, nanosystec, National Physical Laboratory, OpTek Systems, Optim Wafer Services, Optocap, OSRAM OS, Oxsensis, PhoeniX, Photon Delta, Renishaw, SAES Getters S.p.A., SET, Technobis Group, Technology Scotland, Tegema, The University of Southampton, Tyndall National Institute, University of Cambridge, VTT, Yole Developpement.

Optoelectronic packaging is one of the current main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To overcome these challenges, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done.

Traditionally, each optoelectronic technology has followed their own packaging roadmaps, technologies, design rules and standards (eg. PIC (Photonic IC), VCSELs, MEMS based sensors, LEDs, etc.). This workshop will explore common challenges between different photonic technologies as well as bring together the entire value chain in order to identify the current bottlenecks and the ways to circumvent them.

Network with top technology experts from key organizations such as  FiconTEC, Huawei, IBM, Kaiam, Linkra, LioniX, Microtest, MIRPHAB, Optocap, Oxsensis, PhoeniX Software, Photon Delta, Technobis,Tegema,Tyndall Institute, VTT and YoleDeveloppement

Why attend?
  • Listen to and engage with leading industrial practitioners
  • Update yourself on the latest market trends
  • Network with the entire supply chain including end-users, integrators and materials & equipment suppliers
  • Gain insight into assembly process developments from a range of industrial sectors
  • Visit the state of the art research facilities at Heriot Watt University
Programme

The programme includes the following topics and will take place over the course Tuesday 22 and Wednesday 23 November:
– User perspectives
– Packaging design, software and support services
– Packaging services, equipment and testing
– Integrators and user cases

A company visit to Kaiam has been arranged on Monday 21 November at 15.00 and followed by a dinner, exclusively for EPIC members! Please contact Carmen Ferrari, Events and Marketing Manager (carmen.ferrari@epic-assoc.com), if you’d like to join this function.

For the full programme please see click here 

Registration fees*

Members of IMAPS-UK, JEMI-UK, SEMI or EPIC: £185
Students: £125
Non Members: £225

*All fees are excluding VAT and inclusive of free parking, lunch & refreshments

Please register here