EPIC Meeting on Automation Tools for Packaging and Testing at ASM AMICRA

23-24 May 2019

Regensburg, Germany

Hosted at: ASM AMICRA

ASMPT

Silver sponsors

LOGO PIXAPP TRANSPARENCIA
LOGO MIRPHAB LONG FORM (web) (1)
Capa 0
inpulse logo[1][1]

ALL THE PRESENTATIONS OF THE EVENT CAN BE FOUND HERE.

The purpose of this meeting is to bring together equipment manufacturers and companies investing or interested in the further automation of their high precision manufacturing and testing lines, to discuss the production of optoelectronic components and modules (Silicon Photonics, PICs, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP,…)  and to identify bottlenecks in process automation for any industry (HPLD manufacturing, fiber-optics and opto-electronics, medical technology, security and military applications, R&D, telecommunications, and others) and volume demand.

Agenda

23 May 2019 Thursday

09:30 Optional bus transfer from ORPHEE Hotel to Broadcom (departure meeting point: hotel lobby)
10:00 – 11:15 Optional company visit @ Broadcom (limited to 30 people based on first come – first served basis, no places available anymore)
11:30 Optional bus transfer from Broadcom to ASM AMICRA

11:30 Optional bus transfer from ORPHEE Hotel to ASM AMICRA (departure meeting point: hotel lobby)
12:00 – 13:00 Registration & Lunch @ ASM AMICRA
13:00 – 13:05 Welcoming words by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium
13:05 – 13:15 Welcoming words by Rudolf Kaiser, Managing Director, ASM AMICRA (GERMANY)

13:15 – 13:45 KEYNOTE: Silicon photonics – enabler for pure passive alignment process in high volume production?
Rudolf Kaiser, Managing Director, ASM AMICRA (GERMANY)

SESSION 1: SETTING UP THE SCENE
13:45 – 14:15 KEYNOTE: Packaging of integrated photonic devices and scale-up through pilot lines
Peter O’Brien, Head of Group, Photonics Packaging, Tyndall National Institute (IRELAND)
14:15 – 14:30 Announcement of PIXAPP pre-commercial run
Ana Gonzalez, R&D Manager, EPIC – European Photonics Industry Consortium
14:30 – 14:45 From lab to fab – requirements on modern micro assembly systems from a european perspective
Hermann Moos, Head of Technology Scouting & Product Manager, Finetech (GERMANY)
14:45 – 15:00 Innovation services for photonic industry
Andrzej Sielecki, Technologist – Photonic Assembly, Philips Innovation Services (THE NETHERLANDS)
15:00 – 15:15 Automatic look up table generation techniques for PICs
Andrea Melloni, Professor, Politecnico di Milano (ITALY)

15:15 – 16:00 Coffee break

SESSION 2: PACKAGING & ASSEMBLY TOOLS AND TECHNIQUES
16:00 – 16:15 Assembly equipment for polarization maintaining fiber arrays
Sebastian Haag, CEO, Aixemtec (GERMANY)
16:15 – 16:30 Packaging and assembly challenges for photonic integrated circuits
Yigit Ozan Yilmaz, Technical Expert, imec (BELGIUM)
16:30 – 16:45 NanoGPS OxyO, an absolute x, y, theta encoder technology with high precision, flexible implementation and machine-vision compatibility
Olivier Acher, Director Innovation, HORIBA (FRANCE)
16:45 – 17:00 Just another axis: precision motion control for optic and photonic device manufacturing 
Brett Heintz, Applications Engineer, Aerotech (USA)
17:00 – 17:15 Lowering assembly & test costs through intelligent micro-robotic technologies
Scott Jordan, Head of Photonics, PI (USA)
17:15 – 17:30 3D-nanoprinting of photonic wirebonds and micro-lenses for photonic integration
Philipp Dietrich, Senior R&D Engineer, Vanguard Automation (GERMANY)

18:00 – 18:30 Bus transfer from ASM AMICRA to a dinner place – Haus Heuport
18:30 – 22:30 Dinner @ Haus Heuport
22:30 Walk from Haus Heuport to ORPHEE hotel

24 May 2019 Friday

07:30 – 08:00 Check out of the hotel
08:00 Bus transfer from ORPHEE hotel to ASM AMICRA (departure meeting point: hotel lobby)
08:30 – 08:55 Morning coffee @ ASM AMICRA
08:55 – 09:00 Recap and introduction to the 2nd day – Jose Pozo, CTO, EPIC – European Photonics Industry Consortium

SESSION 3: VOLUME TESTING OF OPTOELECTRONICS
09:00 – 09:30 KEYNOTE: Flexible platform for automated PIC testing
Antonello Vannucci, R&D Manager, Cordon Electronics (ITALY)
09:30 – 09:45 Optical solution for high volume opto-electronical testing of photonic integrated circuits on wafer level 
Tobias Gnausch, Product Manager Microoptics, JENOPTIK (GERMANY)
09:45 – 10:00 Germanium ion implantation into silicon for wafer-scale testing, programming and automated repair of photonic integrated circuits
Milan Milosevic, Research Fellow, Optoelectronics Research Centre, University of Southampton (UNITED KINGDOM)
10:00 – 10:15 Automated testing of photonic ICs
Xaveer Leijtens, Professor, Eindhoven University of Technology (THE NETHERLANDS)
10:15 – 10:30 Achieving <.1dB coupled power repeatability measurements at wafer level
Mario Berg, Account Manager, FormFactor (GERMANY)
10:30-11:00 Panel discussion: challenges and needs in volume production for the next generation of photonic products
Chair: Ana Gonzalez, R&D Manager, EPIC – European Photonics Industry Consortium 

11:00 – 11:45 Coffee break

SESSSION 4: PACKAGING & ASSEMBLY EQUIPMENT AND SERVICES
11:45 – 12:00 Low latency manufacturing and LiDAR technologies
Evan Hueners, Product Marketing Manager, Palomar Technologies (USA)
12:00 – 12:15 Advanced packaging solutions based on additive microfabrication
Michael Thiel, Co-Founder & CSO, Nanoscribe (GERMANY)
12:15 – 12:30 Automating packaging and assembly for hybrid photonic integration 
Joost van Kerkhof, COO, PHIX (THE NETHERLANDS)
12:30 – 12:45 Facing packaging challenge for tomorrow
Elvis I.C. Wan, Process Development Engineer, Technobis (THE NETHERLANDS)
12:45 – 13:00 MicroOptics with benefits -make your micro-optics packaging easier
Wilfried Noell, Chief Scientist, SUSS MicroOptics (SWITZERLAND)
13:00 – 13:15 Thermoplastic innovations for optical elements
Bernd Grammer, Business Development Manager, SABIC (GERMANY)
13:15 – 13:30 3D heterogeneous integration – enabling technologies for silicon photonics and 3D SOCs
Martin Eibelhuber, Deputy Business Development, EV Group (AUSTRIA)

13:30 – 14:30 Lunch @ ASM AMICRA
14:45 – 16:00 Company visit @ ASM AMICRA
16:15 End

Venues

Optional company visit at Broadcom on 23 May, 10:00 – 11:15 (Gebäude 11 Stockwerk 5 Raum 11.502, Wernerwerkstrasse 2, 93049 Regensburg).

The meeting will be held at ASM AMICRA (Marie – Curie Str.6, D-93055, Regensburg, Germany). If you are coming by a car, parking directions can be find HERE.

The dinner will be held at Haus Heuport (Domplatz 7, D-93047, Regensburg).

Hotel

Please be informed that no rooms are available anymore at the main hotel –  ORPHEE Hotel (address: Untere Bachgasse 8, 93047, Regensburg).

We recommend to book other nearby accomodations:

  • Regensburg-Apart (address: Neupfarrplatz 6a, 93047 Regensburg) – 100 EUR / night on booking.com, 3 min. walk from the main hotel, 1 min. walk from the dinner place (FULLY BOOKED)
  • Hotel Bischofshof am Dam (address: Krauterermarkt 3, 93047 Regensburg) – 160 EUR / night on booking.com, 4 min. walk from the main hotel, 2 min. walk from the dinner place (FULLY BOOKED)
  • Altstadthotel Arch – Neues Haus (address: Haidplatz 2, 93047 Regensburg) (1 ROOM AVAILABLE updated 05.17)
  • Arnulfsplatz Aparts (address: Arnulfsplatz 5, 93047 Regensburg) (1 ROOM AVAILABLE updated 05.17)
  • Altstadt Regensburg (address: Engelburgergasse 20, 93047 Regensburg) (1 ROOM AVAILABLE updated 05.17)

Or any other close by located hotel of your choice.

Please also note that almost none of the hotels in this area have parking lots. If you are arriving by car, we recommend to park it in parking garage at Dachauplatz (address: Dr.-Wunderle-Straße 8, 93047 Regensburg).

Registration

Registration for this event is already sold out. If you have any questions, please contact EPIC Events Manager, Neringa Norbutaite by: neringa.norbutaite@epic-assoc.com

Contacts

EPIC Events Manager, Neringa Norbutaite, neringa.norbutaite@epic-assoc.com, mobile: +37062438991

Onsite contacts:
EPIC Marketing Manager, Auri Ripoll, mobile: +34683343793
EPIC CTO, Jose Pozo, mobile: +31626978312
EPIC R&D Manager, Ana Gonzalez, mobile: +34 669687196