EPIC Meeting on Beyond 400G at Microsoft


28-29 April 2020

Seattle, WA, USA

In partnership with COBO


Hosted by Microsoft


Supported by


PIXAPP Pilot Line
JePPIX Pilot Line

The EPIC Meeting on Beyond 400G at Microsoft will be postponed, the exact dates will be communicated very shortly. In the meantime, if you have suggestions for the ideal date (in either July 2020 or April 2021), or any other concern, please contact event manager Ms Helena Jelinkova.

In the past few years, the demand in terms of connectivity and data rates have experienced a huge increase.  A further boost is expected once rapidly expanding technologies such as Internet of Things – IoT and the 5G transport networks will be fully exploited and data centers will further increase in number and extension. 

For these reasons, EPIC in collaboration with the Consortium for On-Board Optics – COBO intends to explore the innovative photonics technologies that are being developed in order to maximize the data throughput and to extend data delivery speeds beyond 400 Gbps. 

At this joint meeting, the complete value chain spanning from the large data center operators and network providers to the technical optics and network developers will be present.  The production of faster switches, together with an increment of higher-performance VCSELs, silicon photonics, InP-based PICs, polymer, plasmonics and DML/EMLs for transceivers, depending on the reach length, will be imperative and into the scope of this meeting. Furthermore, the expected competition between direct and coherent detection systems depending on the addressed transmission distances, the pluggability options for optics and the present challenges to reach and overcome 1Tbps will be in the core of vivid discussions.


Meeting venue:  Room Steptoe, Building 40. Address: 15563 NE 31st Street, Redmond, WA 98052
The recommended hotel is Hampton Inn & Suites Seattle/Redmont. Book your room at special price 169 USD by email: donna.leung@hilton.com or by phone: +1-425-553-1205

The bus transfers will be only arranged from and to this hotel.
The dinner venue will be announced soon.


Day 1

Company visits – TBA

Day 2

09:00 – 12:00 Company visits – TBA
11:30 Optional bus departure from the recommended hotel to Microsoft
12:00 – 13:00 Registration & light lunch @ Microsoft
13:00 – 15:00 SESSION 1
KEYNOTE by the host – Brad Booth, Principal Network Hardware Manager, Microsoft
KEYNOTE presentation
Panel discussion from Datacenters
15:00 – 15:45 Networking coffee break
15:45 – 17:30 Session 2: Beyond 400G at Device Level
KEYNOTE presentation
6 presentations of selected Silicon Photonics/PIC modules manufacturers
17:30 – 18:00 Bus transfer from Microsoft to a dinner venue
18:00 – 22:00 Dinner

Day 3

07:30 – 08:00 Check out of the hotel
08:00 – 08:20 Bus transfer from the recommended hotel to Microsoft
08:20 – 08:55 Morning coffee @ Microsoft
08:55 – 09:00 Recap by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium
09:00 – 11:00 SESSION 3: Optical Networks Beyond 400G
KEYNOTE presentation by a telecom operator
Selected presentations from solution and network testing providers
11:00 – 11:45 Networking coffee break
11:45 – 13:00 SESSION 4: How to move forward: 800G-1.6T
KEYNOTE presentation: the Need for 200GBaud transceiver and solutions
Closing panel discussion on mapping demands
13:00 – 14:00 Lunch
14:00 – 15:00 Microsoft company tour
15:30 End and departures

Confirmed speakers:

KEYNOTE: Supply Chain Challenges for beyond 400G – Vipul Patel, Senior Technology Leader, Cisco
KEYNOTE: Michael Robertson, VP Research Programmes, Huawei
KEYNOTE: Scott Schube,  Director of Strategic Development, Intel
KEYNOTE: Radha Nagarajan, CTO, Inphi
KEYNOTE: Gert Grammel, Solutions and Network Architecture, Juniper Networks
KEYNOTE: Michael Lebby, CEO, Lightwave Logic
KEYNOTE: Mohand Achouche, Director of Hardware Strategy, Nokia Bell Labs – III-V Lab

Other speakers and topics confirmed:
Modular Automation – the key to high volume photonics manufacturing in a fast changing environment
Torsten Vahrenkamp, CEO, ficonTEC
High density in-board optical connectivity for datacenter switches operating beyond 25 Tb/s
Benoit Fleury, Market Development Director, Corning
InP and Hybrid Integration for 400G
Ute Troppenz, Research Scientist, Fraunhofer Heinrich Hertz Institute
Transceiver Technology Choices for Tomorrow’s Data Center Market
Vipul Bhatt, Director Strategic Marketing, Datacom, II-VI
Fiber Optic Connectivity Trend beyond 100G modules
Tiger Ninomiya, Business Development Manager, SENKO Advanced Components

Rob Stone, Senior Vice President & General Manager, Broadcom
Ruth Houbertz, CEO, Multiphoton Optics


For more information about this meeting please contact EPIC Events Manager, Helena Jelinkova – email: helena.jelinkova@epic-assoc.com; mobile: +420 606526252