EPIC Meeting on Optical Communications: Coherent or Incoherent at HUBER+SUHNER Cube Optics

21-22 March 2019

Mainz, Germany

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About a decade ago, many telecom operators rapidly adopted coherent transmission since the first deployments of DSP-based coherent technologies to long-haul applications. Coherent technology is now starting to be extended throughout the metro networks and it is expected that soon it will be deployed in access networks to meet increasing bandwidth demands. Where 10-Gbps wavelengths were deployed in 50-GHz grid WDM systems, 100-Gbps wavelengths implemented with around 32-Gbaud symbol rates have been deployed on the same multiplexers and amplifiers with greater reach and enhanced impairment tolerance, thereby simplifying capacity migration. More recently, second-generation flex-coherent modulation enabling 200-Gbps wavelengths with 16QAM or 8QAM modulation, and now the first 400-Gbps wavelength deployments at higher baud rates, are being deployed. Investments in DSP technologies with ever higher CMOS integration will shortly enable a new generation of up to 600-Gbps wavelengths with highly configurable baud rates and modulation up to 64QAM with a large degree of modulation control. Beyond this we can expect to see 800-Gbps or even 1.2-Tbps wavelengths in the future, with higher baud rates to enable 400-Gbps quantization of the wavelength capacity (source: P. Morkel et.al, ADVA Optical Networking, Lightwave, May 2018). The new modulation formats, with their advanced coding and forward error correction (FEC), are bringing networks closer to the Shannon limit. Skirting this limit to extract the maximum utilization for real networks with complex topologies and traffic requirements requires additional consideration of network planning and management, starting from new approaches on the physical layer, such as, for example coherent transceivers in Silicon Photonics or Indium phosphide integrating local oscillators.

The purpose of this meeting is to bring together the whole value chain of optical communications, on the physical, link and network layers and have a fruitful discussion on how to address the present and future needs of optical communications.

Agenda

21 March 2019 Thursday

11:30 Optional bus transfer to HUBER+SUHNER Cube Optics (meeting point: Hilton Mainz lobby)
12:00 – 13:00 Registration & Lunch @ HUBER+SUHNER Cube Optics

13:00 – 13:05 Welcoming words by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium
13:05 – 13:15 Welcoming words by Thomas Paatzsch, General Manager, HUBER+SUHNER Cube Optics (GERMANY)

13:15 – 13:45 KEYNOTE: Low-cost packaging for high performance multi-lambda T/ROSAs
Sven Krueger, VP Product Management & Sales,  HUBER+SUHNER Cube Optics (GERMANY)

SESSION 1: Setting up the Scene

13:45  – 14:15 KEYNOTE: Planning link system behaviors – an opto-electrical story
Hugues Tournier, SI/PI Senior Manager, Ciena (CANADA)
14:15 – 14:45 KEYNOTE: Real time monitoring of coherent optical networks 
Gert Grammel, Juniper Networks (GERMANY)
14:45 – 15:00 Synchronization system with opto-electronic oscillator for long-term stability over optical infrastructure
Bostjan Batagelj, Professor, University of Ljubljana (SLOVENIA)
15:00 – 15:15 Coherent radio-over-fiber xhaul for mobile 3G/4G/5G networks
Andreas Stoehr, Professor, University Duisburg-Essen (GERMANY)

15:15 – 16:00 Coffee break

SESSION 2: Towards Integrated Technologies for Coherent modules

16:00 – 16:30 KEYNOTE: Evolution of coherent optics for telecom and DCI applications
Takashi Saida, Project Manager, NTT (JAPAN)
16:30 – 16:45 Development work for SiP coupling
Miguel Miyamoto, General Manager, SENKO Advanced Components (UNITED KINGDOM)
16:45 – 17:00 Integrating photonics technologies to realize a 100Tb/s programmable link architecture for scalable and agile metro networks
Christian Neumeyr, CEO, Vertilas, PASSION project partner (EU-H2020) (GERMANY)
17:00 – 17:15 InPulse – the european pilot line for indium phosphide photonic integration
Martijn Heck, Associate Professor, Aarhus University (DENMARK)
17:15 – 17:30 InP optoelectronics for high symbol rates
Patrick Runge, Head of Detectors Group, Fraunhofer HHI (GERMANY)
17:30 – 17:45 3D laser written glass components for photonic integration in communications systems
Nicholas Psaila, CEO, Optoscribe (UNITED KINGDOM)
17:45 – 18:00 Fiber to silicon photonics chip interface with glass technology to reduce coupling losses and improve assembly in optical communication transceivers
Adrien Billat, R&D Engineer, Teem Photonics (FRANCE)
18:00 – 18:15 Electro – optical circuit boards enabling compact and efficient direct-on-board assembly of photonic chips
Tobias Lamprecht, CTO, vario – optics (SWITZERLAND)
18:15 – 18:30 Update on Standardization Activities in Coherent Modules by the COBO Alliance
Hugues Tournier, SI/PI Senior Manager, Ciena (CANADA)

Interview with Hugues Tournier (Click here )

18:45 Bus transfer from HUBER+SUHNER Cube Optics to a dinner place – HEILIGGEIST
19:15 – 22:30 Dinner @ HEILIGGEIST
22:30 Walk from HEILLIGGEIST to Hilton Mainz hotel

22 March 2019 Friday

08:00 – 08:30 Bus transfer from Hilton Mainz hotel to HUBER+SUHNER Cube Optics (meeting point: Hilton Mainz lobby)
08:30 – 08:55 Morning coffee @ HUBER+SUHNER Cube Optics
08:55 – 09:00 Recap by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium

SESSION 3: The Necessary Ingredients in Coherent Communications 

09:00 – 09:15 SOAs for range extended optical ethernet
Leo Spiekman, CTO, Aeon Corp. (USA)
09:15 – 09:30 Electro-optic modulation beyond 100 GHz on the silicon platform
Claudia Hoessbacher, Polariton Technologies (SWITZERLAND)
09:30 – 09:45 Ultrafast graphene photodetectors integrated on silicon chips
Daniel Schall, Group Leader, AMO (GERMANY)
09:45 – 10:00 Graphene photonics for datacom applications
Vito Sorianello, Senior Researcher, CNIT (ITALY)
10:00 – 10:15 Exploring new system concepts and comparing technology alternatives with professional simulation tools 
Stefanos Dris, Group Leader – Transmission Systems, VPIphotonics (GERMANY)
10:15 – 10:30 Leveraging photonic simulations from physical component up to system level and beyond
Seyedreza Hosseini, Engineering & Support, 3DS (GERMANY)
10:30 – 10:45 Micro – optics with benefits – how to make packaging easier
Wilfried Noell, Chief Scientist, SUSS MicroOptics (SWITZERLAND)
10:45 – 11:00 Thermoplastic innovation on optical elements
Bernd Grammer, New Business Development Manager, SABIC Innovative Plastics (GERMANY)

11:00 – 11:45 Coffee break

SESSION 4: Packaging and Assembly 

11:45 – 12:15 KEYNOTE: Efficient manufacturing for photonics/electronics co-packaging
Alexander Janta-Polczyski, Advanced Manufacturing Engineer, IBM (CANADA)
12:15 – 12:30 Mass manufacturing of Tb/s data center transceivers
Tolga Tekin, PPS Manager, Fraunhofer IZM (GERMANY)
12:30 – 12:45 PIC packaging: from lab to production
Andrea Annoni, Photonic Packaging Engineer, Cordon Electronics (ITALY)
12:45 – 13:00 Exploiting simple photolithographic polymer structure for high speed collective and passive optical coupling 
Jean-Luc Polleux, Director of International Relations, ESIEE PARIS (FRANCE)
13:00 – 13:15 Advanced materials solutions for Optoelectronic Devices packaging
Alessio Corazza, Business Developer, SAES (ITALY)
13:15 – 13:30 Assembly lines in modern photonics
Aljoscha Schu, Sales Europe, ficonTEC (GERMANY)

13:30 – 14:30 Lunch @ HUBER+SUHNER Cube Optics
14:45 – 16:15 Guided tour through Cube Optics facilities
16:30 End

Venues

The Meeting will be held at HUBER+SUHNER Cube Optics (Eindhoven-Allee 3, 55129, Mainz).

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The dinner on 21 March will be held at HEILIGGEIST, hall Gewolbesaal (Rentengasse 2, 55116, Mainz).

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Hotel

We highly recommend to book your accommodation at Hilton Mainz (Rheinstrasse 68, 55116, Mainz) hotel, which is located on the river bank within a wonderful walking distance from the dinner location. Bookings can be made by reservations.mainz@hilton.com  for 169 EUR incl. breakfast. Please mention the code EPIC. Transfers to / from HUBER+SUHNER Cube Optics will be organized from / to this hotel only.

Exterior Hilton Mainz

Registration

EPIC members and invited companies: 250 EUR (excluding VAT);  non-members: 450 EUR (excluding VAT). By filling in the registration form below you agree your email to be used to keep you updated about the event. We will also share the registered participants list with the other participants or interested parties (except emails). Attendance is limited to 1 person per company. 

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Contacts

EPIC Events Manager Neringa Norbutaite, mobile: +370 624 389 91, email: neringa.norbutaite@epic-assoc.com

Onsite contacts:
Jose Pozo, CTO, EPIC, mobile: +31 6 26 978312
Ana Gonzalez, R&D Manager, EPIC, mobile: +34 669 68 71 96