The need to improve, speed-up, and reduce cost of packaging and assembly of optoelectronic devices is in constant debate. But as production numbers increase, another need is also attracting more attention: Testing. In many optoelectronic devices (Silicon Photonics, InP PICs, VCSELs, LEDs, DFB lasers…) testing is performed at wafer level, at die level, as well as in a packaged device or module, and requires the combination of more conventional electrical probing and optical measurements, either with probing fibres or by means of near field / far field beam analysers. The meeting will discuss the requirements and find combined solutions by means of collaboration between top companies and R&D centres in the field. Similar to packaging, testing starts at design level and ends with automated test machines. The discussions will range from probing techniques, handling, test procedures and also touch briefly on the needs and requirements for dedicated modular instrumentation.
THURSDAY 15 FEBRUARY 2018
12:00-13:00 REGISTRATION AND LUNCH @YELO
13:00-13:10 Welcoming words, program overview / Jose Pozo, Director of Technology, EPIC
13:10-13:20 Welcoming words / Richard Furey, VP Research and Development, YELO
13:20-13:50 Challenges and Considerations for Burn-in and Test/ Dylan Burke, Marketing Executive, YELO
13:50-14:20 Silicon Photonic Integration Platform for Optical Communications and its Testing / Hiroshi Fukuda, Senior Research Engineer, NTT
14:20-15:00 NETWORKING BREAK
Session 1: Wafer Level testing I
15:00-15:30 From singulated devices to wafer level testing: requirements & challenges / Ignazio Piacentini, Director of Business Development, ficonTEC
15:30-16:00 Wafer-level electro-optical testing of silicon photonics components / Jeroen De Coster, R&D Engineer, imec
16:00-16:30 Automated Testing for Generic Integration Platforms / Weiming Yao, Researcher, Photonic Integration Technology Center
16:30-17:30 PANEL DISCUSSION: Parameters to measure vs testing time at wafer level & closing remarks by Jose Pozo, CTO, EPIC
17:30-18:00 Transfer from YELO to Titanic restaurant
18:00-21:00 DINNER @ TITANIC RESTAURANT
FRIDAY 16 FEBRUARY 2018
09:00 Transfer from Titanic Hotel to YELO. We kindly remind you to check out of the hotel and take your luggage if you are planning to leave to an airport after the workshop.
09:30-10:00 NETWORKING WELCOMING COFFEE @YELO
10:00-10:10 Opening of the 2nd day / Jose Pozo, CTO, EPIC
Session 2: Automated electro-optical characterization
10:10-10:40 Highly reproducible fabrication and testing of silicon photonics devices on 300-mm wafers / Tsuyoshi Horikawa, Senior Researcher, PETRA
10:40-11:10 Reducing Production Test Costs by 99% Through Parallelism / Scott Jordan, Head of Photonics, Physik Instrumente (PI)
11:10-12:00 EXTENDED PRESENTATION: Fast and accurate electro-optical characterization of photonics circuits / Philippe Grosse, Engineer, Cea & Patrick Le Maitre, R&D Engineer, STMicroelectronics
12:00-13:30 NETWORKING LUNCH
Session 3: Dye level and packaged device level
13:30-14:00 High Frequency Testing of Novel Low Loss RF and Microwave Interconnects for a New 50GHz GaAs Optical Modulator / Nigel Cameron, Applications Engineer, Axenic
14:00-14:15 Testing of photonic integrated comb sources with DC and RF inputs / Frank Smyth, CEO, Pilot Photonics
14:15-14:30 Design and Test of a PIC based FBG Interrogator / Selwan K. Ibrahim, Principal Engineer, FAZ Technologies
14:30-14:40 Industrial Opportunities with the Centre for Doctoral Training in Photonic Integration / Caryn Hughes, External Engagement Manager, EPSRC Centre for Doctoral Training in Photonic Integration & Advanced Data Storage (Queen’s University Belfast & University of Glasgow)
14:40-15:00 Panel discussion & closing remarks
15:00 End of the meeting
15:05-16:00 COMPANY VISIT (optional)
The recommended hotel for all participants is Titanic Hotel Belfast (Queen’s Road, Titanic Quarter, Belfast BT3 9DT, Northern Ireland).
Please book your room (-s) over the phone : 028 9508 2000 or email: email@example.com. Please mention EPIC while registering.
EPIC members and invited companies: 200 EUR (excluding VAT).
Non-members: 300 EUR (excluding VAT).