EPIC Meeting on VCSELs Technology and Applications at Sony

17-18 October 2019

Stuttgart, Germany

Hosted at: 

Sony

Sponsored by:

Gold sponsor

LOGO PIXAPP TRANSPARENCIA

Silver sponsor

Passion

Bronze sponsor

logo jeppix

Due to their stability, small size, temperature stability, simplicity and low cost of manufacturing and testing, VCSELs are becoming the dominant light source technology in volume applications. With the arrival of VCSELs to consumer markets the new era of semiconductor laser applications has arrived: we can find now VCSELs in smartphones, laptops, drones, robots, and cars enabling new functionalities such as: proximity sensing; high resolution (4K or Retina resolutions), fast frame-rate, and 3D video; remote powering of sensors optically (while simultaneously transmitting data); LIDAR, illumination, night vision, aerospace, and line-of-sight communication links, using high power VCSELs arrays; chip scale atomic clocks (CSAC); indoor positioning systems; and many more.

The purpose of the EPIC Meeting on VCSELs Technology and Applications at Sony aims to bring together some of the companies driving the abovementioned applications together with the full value chain of VCSELs including: OEMs, integrators, device manufacturers, epi houses, foundries, equipment and material suppliers.

Program

17 October 2019 Thursday

11:30 Bus departure from Best Western Plus Hotel Fellbach-Stuttgart to Sony (optional, meeting point: lobby)
12:00 – 13:00 Registration & lunch @ Sony

13:00 – 13:05 Welcoming words by Jose Pozo, CTO, EPIC – European Photonics Industry Consortium
13:05 – 13:15 Welcoming words by Klaus Zimmermann, General Manager, Technology Partnerships EU, Sony
13:15 – 13:45 VCSEL and edge-emitting laser technology at Sony
Osamu Maeda, Sr. Product Manager, Sony Semiconductor Solutions (JAPAN)

SESSION 1: Setting up the scene

13:45 – 14:15 KEYNOTE:Technology enhancements and new applications for VCSELs
Mary Hibbs-Brenner, CEO, Osram, Vixar Subsidiary (USA)
14:15 – 14:45 KEYNOTE: Best practice for VCSEL ToF systems and model driven design
Krzysztof Szczerba, Sr. Staff Engineer, Finisar (USA)
14:45 – 15:15 KEYNOTE: Forthright scrutiny of the VCSEL business: opportunities & obstacles
Mark Lutkowitz, Principal, fibeReality (USA)
15:15 – 15:30 VCSEL arrays form 5G optical wireless mesh network backhaul
Jim Lott, Co-Founder, Optipulse (USA)

15:30 – 16:15 Coffee break

SESSION 2: VCSEL Manufacturers perspective and supply chain (testing, assembly…)

2.1. Manufacturers perspective
16:15 – 16:30 Long wavelength VCSELs and VCSEL arrays for advanced applications in sensing and optical communications
Christian Neumeyr, CEO, Vertilas (GERMANY)
16:30 – 16:45 Progress in non-polar and semi-polar GaN VCSELs
Tal Margalith, Executive Director of Technology, SSLEEC, UC Santa Barbara (USA)
16:45 – 17:00 Metrology for MOCVD of VCSELs – latest progress for enabling high-yield manufacturing
Christian Kaspari, Senior Engineer Concept Development, Laytec (GERMANY)

2.2. Design and modeling
17:00 – 17:15 A comprehensive 3D VCSEL simulator environment
Dominic Gallagher, CEO, Photon Design (UNITED KINGDOM)
17:15 – 17:30 VCSEL device and system design for manufacturing
Twan Korthorst, Director R&D, Synopsys (THE NETHERLANDS)
17:30 – 17:45 Modelling optical properties & gain spectra of VCSEL devices
Geoffrey Duggan, EMEA Regional Manager, Lumerical (UNITED KINGDOM)

2.3. Packaging, assembly and test
17:45 – 18:00 Successfully combining VCSELs with silicon – a PhotonX Networks perspective
Oded Raz, Co-Founder, PhotonX Networks (The Netherlands)
18:00 – 18:15 VCSEL ageing and packaging
Martin Zoldak, Argotech (Czech Republic)
18:15 – 18:30 Burn-in and life test of optoelectronic devices
Declan McCaughley, Technical Concepts Engineer, Yelo (UNITED KINGDOM)

18:45 – 19:15 Bus transfer from Sony to a dinner place
19:30 – 22:30 Dinner @ Atrium restaurant, Best Western Plus Hotel Fellbach-Stuttgart

18 October 2019 Friday

07:30 – 08:00 Check out of the hotel
08:00 Bus departure from Best Western Plus Hotel Fellbach-Stuttgart to Sony (meeting point: lobby)
08:30 – 08:55 Morning coffee @ Sony
08:55 – 09:00 Recap and introduction to the 2nd day – Jose Pozo, CTO, EPIC – European Photonics Industry Consortium

SESSION 3: New developments for existing applications (ToF, faceID, LIDAR, optical comms,…)

09:00 – 09:15 VCSEL – a market fueled by smartphone applications. But not only…
Pierrick Boulay, Market & Technology Analyst, Yole Development (FRANCE)
09:15 – 09:45 KEYNOTE: VCSEL – driven ToF applications and its market trend
Andy Seo, Sr. Product Line Manager, Lumentum (USA)
09:45 – 10:15 KEYNOTE:High power VCSELs for 3D cameras 
Julien Boucart, Sr. Product Manager, II-VI Laser Enterprise (SWITZERLAND)
 10:15 – 10:30 About a VCSEL: core component of a LiDAR sensor family
Eckart Gerster, Quality and Reliability Manager, SICK (GERMANY)
10:30 – 10:45 High power VCSELs for non-hermetic time-of-flight modules
Gunther Steinle, System Engineer and Project Manager, Avago Technologies (GERMANY)
10:45 – 11:00 Thermoplastic innovations for optical element
Bernd Grammer, New Business Development Manager, SABIC Innovative Plastics (GERMANY)

11:00 – 11:30 Coffee break

SESSION 4: Upcoming applications (atomic clocks, high power pump lasers, smart pixel displays, lighting…) 

11:30 – 12:00 KEYNOTE:Applications for broadly tunable MEMS-VCSELs
Peter Heim, CTO & General Manager, Thorlabs Quantum Electronics (USA)
12:00 – 12:15 Sony’s blue and green VCSELs for future applications
Tatsushi Hamaguchi, Senior Scientist, Sony (JAPAN)
12:15 – 12:30 13xx nm GaAs-based VCSEL arrays for sensing applications
Sabeur Siala, VP R&D & Engineering, Array Photonics (USA)
12:30 – 12:45 VCSEL in automotive 4D solid-state LiDAR application
Friederieke Gorris, VCSEL Technology Expert, Ibeo Automotive Systems (GERMANY)
12:45 – 13:00 VCSEL miniature packages from implants to space
Stefan Mohrdiek, Head of Packaging & Optics, CSEM (SWITZERLAND)
13:00 – 13:15 High precision 3D printing (HP3DP) – freeform optics for VCSEL applications
Benedikt Stender, CTO, Multiphoton Optics (GERMANY)

13:30 – 14:30 Lunch @ Sony
14:30 – 15:30 Company visit @ Sony
15:30 End and bus departure from Sony to Stuttgart airport (optional)

Venues

The meeting venue: Sony Europe BV, Zweigniederlassung Deutschland located in Stuttgart Technology Center (Hedelfinger Str. 61. 70327 Stuttgart, Germany).

The dinner on 17 October will be held at the recommended hotel restaurant Atrium, Best Western Plus Hotel Fellbach-Stuttgart (address: Tainer Straße 9, D-70734 Fellbach).

Hotel

We strongly recommend to book Best Western Plus Hotel Fellbach-Stuttgart (address: Warth GmbH, Tainer Straße 9, D-70734, Fellbach, Stuttgart) for your accommodation, because the bus transfers to / from Sony will be organized only from / to this hotel. Bookings can be made by reservierung@bestwestern-fellbach.de, mentioning the code EPIC or external systems (e.g. booking.com). The preliminary daily comfort single room rate is 159 EUR per person including breakfast. Please note that this hotel is now only available for 17-18 October. For 16 – 17 October we recommend to book alternative hotels within a walking distance, e.g. City Hotel Fellbach (address: Bruckstrasse 3, 70734 Fellbach, Germany) for 124 EUR / night located within 800 m (10 min. walking) from Best Western or Alte Kelter (address: Kelterweg 7, 70734 Fellbach, Germany) for 90 EUR / night located within 1.2 km (17 min. walking) from Best Western or Hotel Burkle (address: Augustenstr. 1, Fellbach, 70736, Germany) for 101 EUR / night located within 2.4 km (32 min. walking) from Best Western.

Registration

Due to a limited number of seats, registration for this event is closed. If you have any questions, please contact EPIC Events Manager Neringa Norbutaite by email: neringa.norbutaite@epic-asssoc.com or mobile: +370 624 38991.

Contacts

EPIC Events Manager Neringa Norbutaite, email: neringa.norbutaite@epic-assoc.com; mobile: +370 62438991.