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EPIC Online Technology Meeting on PIC Packaging

26 April 2021

15:00 – 17:00 CEST

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Media Partner

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Topic

In this meeting, we will have an update about new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications and development of large-volume manufacturing processes.

Spirit of the meetings

During these online technology meetings, we are looking for the challenges the industry is facing and bringing together the entire supply chain to address these challenges. Bringing together end-users with component suppliers and system integrators that will answer the EPIC question “What can you do for them and what can they do for you” creates the perfect foundation to establish new business relationships and find ways for new collaborations and partnerships. 

Watch us LIVE on YouTube

These online technology meetings take place in Zoom with a limited group of people. If you would like to attend the meeting, please register below. There are limited seats and we allow only one person per company, but all our online technology meetings can be viewed LIVE on YouTube or be viewed afterwards if you have missed it. Here is the link to this meeting to view it on our YouTube channel EPICPhotonics

Moderators

Jose Pozo, CTO at EPIC
Ana Gonzalez, R&D Manager at EPIC

Speakers

He previously founded two photonic companies and established the Photonics Packaging and Integration Group at Tyndall in 2009. Peter is also Deputy Director of the Irish Photonics Integration Centre.

Peter O’Brien
Director of PIXAPP

Michael is also a part-time full professor, and chair of optoelectronics at Glyndwr University in Wales, UK. He has been focusing on InP-based PICs and optoelectronic integrated circuits (OEICs) for the datacenter segment.

Michael Lebby
CEO & Board Member at Lightwave Logic

More information about Alexander can be found HERE.

Alexander Janta-Polczynski
Advanced Manufacturing Engineer at IBM

Attendees

Chang Ray, Technical Program Manager at Broadcom
Daniele Palaferri, Laser Scientist at GEM elettronica
David Heard, Vice President Sales at Santec
Dietrich Wins, Product Marketing Manager at PI
Dimitrios Kalavrouziotis, Senior Engineer at NVIDIA
Dowon Kim, Senior Staff Engineer at Intel
Erich Schlaffer, Program Manager at AT&S
Francois Menard, CTO at AEPONYX
Frank Ernst, Business Development Manager at NTS Optel
Gary Nicholl, Principal Engineer at Cisco
Gerd van den Branden, System & Industrialization Director at Prophesee
Giovanni Delrosso, Senior Scientist, Project Manager at VTT
Glenn George, Managing Director at Bay Photonics
Guillermo Carpintero, Professor at Universidad Carlos III de Madrid
Gunther Vollrath , CEO at Aifotec
Henrik Madsen, CEO at SPIO Systems
Joe Callaghan, Senior Technical Planner at Huawei
Johann Lomsek, Business Development at Robooptic Systems
John Parham, Business Development at Bay Photonics
Jose Galan, Sales Manager at VLC Photonics
Karl Muth, Principal Systems Architect at Broadcom
Katarzyna Lawniczuk, Vice President at BRIGHT Photonics
Larry Hsiao, Manager at Accton
Leontios Stampoulidis, Founder at LEO Space Photonics
Luc Augustin, CTO at SMART Photonics
Martin Schell, Executive Director at Fraunhofer HHI
Michael Geiselmann, Managing Director at LIGENTEC
Milan Milosevic, Senior Research Fellow at University of Southampton, Zepler Institute for Photonics and Nanoelectronics (ORC)
Nathan Tracy, Technologist at TE Connectivity
Neil O’Brien, General Manager at Finetech USA
Nikolaus Flöry, Business Development Manager at Vario-optics
Oliver Kirsch, Scientific Researcher at Fraunhofer IZM
Pascual Muñoz, Professor at Universitat Politècnica de València
Peter Kung, President at QPS Photronics
Reinhard Pusch, Advisor at RoodMicrotec
Richard Tsai, Senior Manager at Coretronic
Ronald Habekothe, Sales Manager at US Conec
Ruth Houbertz, Managing Director & Owner at ThinkMade Engineering & Consulting
Stefan Mohrdiek, Section Head at CSEM
Stuart Pearce, Senior Director at AEM
Sven Krüger, Vice President at Huber+Suhner Cube Optics
Sven Otte, CEO at Sicoya
Tolga Tekin, Scientist at Fraunhofer IZM
Tom Marrapode, Director of Advanced Technology Development at Molex
Vincent Zeng, Supplier Quality Engineer at Facebook
Wenchieh Tsai, Sales at Nvidia
Wilfried Jahn, CTO at Silina
Yeeloy Lam, CTO at DenseLight Semiconductors

Registration:

To participate, you need to have access to a computer (preferred) or phone, with video/microphone/sound, you can test your setup on Zoom. By registering, you agree that we can use your data to inform you about the details of this event. EPIC will also share the participants list with the other participants or interested parties. Participation is confirmed only when received a confirmation email from the EPIC staff.
Note: We allow only 1 person per company to participate in the Zoom room. Everyone is of course welcome to join us via YouTube. All attendees in Zoom are expected to participate in the full length of the meeting. By registering you acknowledge our GDPR Statement.
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Contact

EPIC Events Manager, Sharara Qasemova, email: sharara.qasemova@epic-assoc.com, mobile / WhatsApp: +420775465552