EPIC Workshop on Photonic Integrated Circuits

9-10 June 2015

Erich Thallner Strasse 1, 4782 St. Florian am Inn, Austria

Hosted by EVG


The PIC Supply Chain for the Telecom Industry and Data Centres

Increasing bandwidth and reducing power consumption remain goals for the data centre due to the ever increasing traffic demands. It is broadly accepted by now that integrated photonics has the potential to solve some of the technological bottlenecks and offer improved network functionality. Ground-breaking advances in research and development of advanced photonic integrated photonic technologies are constantly occurring.

The purpose of this workshop is to discuss if those advances are in line with some of the supply chain needs, such as:
1) The scaling of photonics to high levels of integration with improved performance, power consumption and better process control at low cost.
2) The need of equipment and process towards wafer scale testing.
3) The incorporation of solutions for low cost standardized packaging.
4) Solving electrical interconnect limits in Data centres, Supercomputers and ICs with higher capacity, lower cost optical interconnects.

With a series of panel discussions and presentations, this workshop brings together representatives of the PIC supply chain in telecom-datacom: from the application driven specifications defined by some of the industrial worldwide leaders, to optical interconnect manufacturers, equipment and packaging experts, integrated photonic designers and, last, but specially not least, wafer level fabrication facilities. Ultimately, the aim is to discuss the state of the art and the technological development needed to satisfy the supply chain demands.


Session 1: Telecom and Data Centres

Chair: Bert Offrein, Manager Photonics Group, IBM Research Zurich   ibm


Torsten Wipiejewski, Advanced Assembly Technology, Huawei European Research Center huawei

Peter De Dobbelaere, Vice President of Engineering, Luxtera 
Cisco (TBC)

Session 2: Electro-Optical Devices and Interconnects

Chair: Jeroen Duis, Engineering Manager & Technology Incubator Corporate Technology, TE Connectivity  ibm


Craig Thompson, Director Strategic Marketing, Finisar  finisar_logo_color 1

Dave Thomson, Senior Research Fellow, Southampton University university of southampton

Marco Romagnoli, CNIT/Scuola Superiore Sant’Anna Pisascuola superiore

Session3: Global Update on PIC

Chair: Michael Lebby, Professor, Glyndwr University Glyndwr

Session 4: Design, Packaging, Testing and Equipment

Chair: Peter O’Brien, Head of Packaging, Tyndall    tyndall


Ruth Houbertz, CEO, Multiphoton Optics  Multiphoton

Paul Lindner, Executive Technology Director, EVG  evg

Guenter Hummelt, CTO, Nanosystec  Nanosystec

David Simms, Director, Yelo   yelo

Twan Korthost, CEO, PhoeniX Software  Phoenix software

Session 5: PIC Fabrication and Services

Chair: TBD


Arne Leinse, Vice President, LioniX Lionix

Sylvie Menezo, Si Photonics Manager, CEA-LETI   cea-leti

Lars Zimmermann, Silicon Photonics Team Leader, IHP

Norbert Grote, Deputy Head Photonic Components Department, Fraunhofer HHI / PARADIGM  Fraunhofer

Mike Wale, Director Active Products Research, Oclaro  oclaro

Richard Visser, CEO, Smart Photonics  smartphonic


9 june 2015
10:00 – 12:00 CEO discussion on PIC business (CEO of EPIC member companies only, on invitation)
12:00 – 13:30 Lunch and Welcome at EVG – Shuttle transfer to Rahaberg Hof (conference location)
13:30 – 14:00 Registration and Welcome Coffee at Rahaberg Hof
14:00 – 18:00 Workshop
18:00 Reception
19:30 Dinner at Restaurant zur Bums‘n (most popular, traditional restaurant in Schärding)
10 june 2015
08:00 Hotels pick-up and transfer to Rahaberg Hof
08:30 Welcome Coffee
09:00-13:00 Workshop
13:30 Company visit and lunch
15:30 End

Shuttles will be arranged from EVG, to the workshop location,
to the evening restaurant and hotels.

All EPIC members are entitled to bring for free a roll-up banner and product flyers. Please inform in advance carlos.lee@epic-assoc.com

Registration (150 EUR for EPIC members, potential members, invited & 450 EUR for non-members). Places are limited to 80, mainly on invitation, and the availability and registration will be confirmed by email.


Hotel Forstinger

EVG room rate: €91,50 incl.
breakfast (reserve with code EVG)

Hotel Gugerbauer

EVG room rate: €80,90 incl.
breakfast (reserve with code EVG)

Stadthotel Schaerding

EVG room rate: €57 incl.
breakfast (reserve with code EVG)

About the host

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers’ fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EVG employs more than 700 people worldwide. Headquartered in St. Florian, Austria, EVG operates via a global customer support network, with subsidiaries in Tempe, AZ.; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea; Chung-Li, Taiwan and Shanghai, China.

evg headquarters
EVG Headquarters
evg factory
EVG Factory
evg conference
EVG Conference